We are currently working on behalf of our client, a billion in sales leader in the wireless chipset market.  They are looking for a Packaging Engineer who will focus on RF chipsets and modules for WLAN, Cell phone and Wimax applications, as well as PAs and Control Circuits on chip for the cell phone market.

You will be a key member of a team that creates Packaging Solutions for Power Amps on chip and Power Amp Front End modules for Handset applications.  Will work closely with Electrical design team to define package requirements/select correct packaging technology to use:

• Need familiarity with high density Packaging Techniques; Chip Scale Packaging, Wafer Level Packaging, Flip Chip, Stacked Die..Wire Bonding, laminate based substrates, die attached technology and SMT.
• Perform Lab Applications work, use tools (AutoCad, Cadence APD).
• Need someone with very strong communications skills to interface effectively with diverse (engineering and cultural) groups.
• Support the design, development, prototype assembly, documentation and release to production of new RFIC and multi-chip module (MCM) packages using appropriate technology.
• Acts as a liaison with internal Advanced Packaging Group, Suppliers, and Internal and External Manufacturing.
• Direct and potentially manage Packaging resources used in design, development and documentation of industry leading wireless semiconductor products.
• Using appropriate tools, perform product cost trade-offs, package integrity analysis (thermal, mechanical, cross-sectioning, assembly process, etc.) for customer and internal requirements.
• Define package requirements for product groups assuring compliance with customer and internal Quality and Reliability requirements.
• Support the design and development of test fixture assemblies for product and product test.

Must work well in a team on problems of a diverse scope where analysis of situations or data requires a review of identifiable factors.  Exercise judgment within defined procedures and practices to determine appropriate solutions.  Position requires a BS degree and 8 years of experience or an MS degree and 5 years of experience with knowledge of state-of-the-art materials (organic substrates, plating finishes, semiconductor materials, etc.) and packaging (die attach, wirebonding, flip chip, high temperature solder reflow, overmold, etc.) related to semiconductor technology for wireless applications.  Experience with Thermal and Mechanical Analysis, Auto-CAD and Cadence APD or similar CAD tools is a preference.  A basic understanding of Micro-Electronic Packaging and Manufacturing is required.