Working on behalf a leading maker of GaN MMICs, RF Power Devices and other MMICs and Modules for Defense, Cable /Broadband and other markets. Looking for an RF Test Engineer, based in Boston MA.
Our client is a leading manufacturer of Cell Phone Power Amplifier ICs and PA FEMs; they seek experienced PA on IC and PA FEM Designers: Power Amplifier Design; Cell Phone/WLAN Design Power Amplifiers on chip, using GaAs HBT, P-HEMT or Silicon device technologies for lower power applications like Cell Phone, WLAN.
Currently working on behalf of a billion in sales leader in the wireless chipset market. They make Analog and RF ICs for the Radio and PA front end signal processing. Looking for a Lead Process Engineer, who will be responsible for device design, process design, and driving improvement of yields, efficiency and cutting costs.
Our client is a leading maker of RF and Mixed signal ICs for Wireless infrastructure, Defense, Medical and Industrial applications.
They are making GaAs and GaN MMIC Power Amplifiers for Base Station, and Defense applications, and looking for GaAs MMIC PA Designers.
Working on behalf of a leading maker of GaAs MMICs, GaN Power Amplifiers for wireless infrastructure and defense applications We need a process integration type who understands the front end process broadly.
Our client is a leading Manufacturer of MMICs and Modules for Defense, Broadband and Wireless Infrastructure applications. For the past 5 years or more, they have consistently outperformed in their markets, and are rapidly growing.
They are looking for a Senior Applications Engineer.
Working on behalf of a leading maker of GaN Power Devices, and other MMICs and Modules for Defense, Cable /Broadband and other markets. Company is looking for a Director of Packaging Technology.
Our client is a leading IC maker that has a very fast growing product line of modules and subsystems for defense/space applications. Looking for Microwave and MMWV Module, MCM and complex Subassembly Designers, responsible for design and production support activities.
Working on behalf of a leading maker of GaN RF Power Devices, and other MMICs and Modules for Defense, Cable /Broadband and other markets. Company is looking for a Principal Packaging Engineer.
Our client is a Leader in Analog, RF and Digital ICs for Wireless, Automotive, Defense and Medical markets.
They have a cutting edge product line of MEMS Gyroscopes, Sensors, Accelerometers, and RF MEMS Filters, and are looking for a MEMS Packaging Technologist. We are looking for an MSEE /PhD Mech Eng with 0-10+ years of MEMS Packaging experience.