Location: California

RF /Microwave component/Power Amplifier Design

Working with a leading maker of high power RF/MW Amplifiers and subsystems for use in CW and pulsed applications from DC to 40GHz.  They are a cutting edge maker of High Power RF amplifier and RF/MW subsystems and systems for radar, electronic warfare, communication systems, test and measurement. 
Job Description
We are seeking Senior RF Design Engineers.

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Photonic IC Device /Process Engineer

Working on behalf of, a leading  foundry that makes GaAs, GaN, InP and other III/V devices for Optical, RF and power conversion applications.. They are looking for a Device Design /Process Engineer who will focus Photonic ICs, DFB Lasers, VCSELs, and PIN/ APD Photodetectors. Will transfer IC designs from customers to their Fab, use their Read more…

Principal Photonic IC Device /Process Engineer

Working on behalf of, a leading  foundry that makes GaAs, GaN, InP and other III/V devices for Optical, RF and power conversion applications.
They are looking for a Principal Device Design /Process Engineer who will focus Photonic ICs, DFB Lasers, VCSELs, and PIN/ APD Photodetectors.

RF Power Amplifier Systems/Applications Engineer

We are working on behalf of our client, a leader in RF Power Transistors and Power Modules for Cellular Base Station applications. Their RF Power group is close to the great job market in Silicon Valley, but much lower in living and housing cost.
They are looking for a Systems Applications Engineer. This person will do board level RF Power Amp Designs, integrating our client’s IC and Module product. They will also understand System level issues like Digital PreDistortion and Doherty, that will allow the System AE to recommend the optimal system level architecture for our client’s RF PAs.

Senior Optical Transceiver Design Engineer

We are working on behalf of a leading maker of ICs for Wireless and Optical Networking applications.
Company has a great heritage for R&D advances in the wireless and optical communications field.
They have a product line of Optical Transceivers for the Optical Networking market, and are looking for a Senior Transceiver Design Engineer.
Will design TOSA/ROSA; (or Transceivers) for Optical Networking space.
Select Components for Optical transceiver design, perform characterization and test for transferring product to manufacture. Manage Signal Integrity issues involved with PCB ( board ) design.
Know HFSS, CST, EMPro or tool for simulating Electromagnetic issues.

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Power Amplifier Characterization / Validation Engineer

Based in Sunnyvale, CA, our client is the leading maker of RF Power Amps and PA Front End Modules for high end Smartphone applications. They have a strong tradition of innovation through R&D.
They are looking for a PA Characterization / Validation Engineer, who will work directly for the PA Design group.

PA Front End Filter/Duplexer Engineering Manager

Currently working on behalf of a leading maker of RF ICs, Power Amplifiers and PA Front End Modules for the Smartphone market. The company holds a dominant share of the market in BAW ( Bulk Acoustic Wave) FBAR filters and Duplexers that go into the PA FEM.
They are currently looking for a technical manager, BAW Filter /Duplexer Module Designer.

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Power Amplifier Packaging Engineer

We are currently working on behalf of our client, a billion in sales leader in the wireless chipset market. They work with power amplifiers, switches, and PA front end modules for commercial wireless applications (cell phone, WLAN, WIMAX, and Infrastructure).
They are currently seeking a Senior Packaging Development Engineer with a BS (or higher) in Mechanical or Chemical Engineering and 5+ years of experience in semiconductor packaging for MCM, LGA, BGA, and QFN form factors .

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Fiber Optic Analog IC Design

Working on behalf of our client, a leader in OEM ICs and components for wireless and optical networking markets. They are a leader in Optical Transceivers for datacom and telecom networking applications.
They are looking for an Analog IC Designer, who will design in CMOS an BiCMOS, designing high speed/ gigabit Ethernet circuits like CDRs and TIAs for hi speed networking applications.

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IC Packaging Engineer

Our client is a fast growing market and technology leader in Cell Phone Power Amplifier and PA Front End modules. They have long been the dominant leader in the passive duplexer/filter part of the PA FEM using MEMS/BAW technology. They are the fastest growing player in the PA on chip and PA FEM market. They are a key PA FEM vendor on the most cutting edge and desirable smart phones made.
They are looking for an IC Packaging Engineer with a BS (or higher) in Materials, Mechanical, or Mechanics Engineering and 2-5 years of industry experience in IC Packaging.

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