Working on behalf of our client, a leading maker of RF and Photonics ICs, based on GaAs, GaN, InP and other 3/5 Devices. They have a product line of High Speed Analog ICs for Photonics, as well as photonics on chip products. Products: TIAs, Laser Drivers Lasers, Modulators. We need a Principal High Speed IC Read more…
Our client is a leading maker of RF and Photonics ICs, based on GaAs, GaN, InP and other 3/5 Devices. They have a product line of High Speed Analog ICs for Photonics, as well as photonics on chip products. Products: TIAs, Laser Drivers Lasers, Modulators. Our client is looking for a Reliability/FA Engineer who understands Read more…
Our client is a leading manufacturer of Cell Phone Power Amplifier ICs and PA FEMs; they seek experienced PA on IC and PA FEM Designers: Power Amplifier Design; Cell Phone/WLAN Design Power Amplifiers on chip, using GaAs HBT, P-HEMT or Silicon device technologies for lower power applications like Cell Phone, WLAN.
We are working on behalf of our client, a leader in RF Power Transistors and Power Modules for Cellular Base Station applications. Their RF Power group is close to the great job market in Silicon Valley, but much lower in living and housing cost.
They are looking for a Systems Applications Engineer. This person will do board level RF Power Amp Designs, integrating our client’s IC and Module product. They will also understand System level issues like Digital PreDistortion and Doherty, that will allow the System AE to recommend the optimal system level architecture for our client’s RF PAs.
We are working on behalf of a leading maker of ICs for Wireless and Optical Networking applications.
Company has a great heritage for R&D advances in the wireless and optical communications field.
They have a product line of Optical Transceivers for the Optical Networking market, and are looking for a Senior Transceiver Design Engineer.
Will design TOSA/ROSA; (or Transceivers) for Optical Networking space.
Select Components for Optical transceiver design, perform characterization and test for transferring product to manufacture. Manage Signal Integrity issues involved with PCB ( board ) design.
Know HFSS, CST, EMPro or tool for simulating Electromagnetic issues.
Based in Sunnyvale, CA, our client is the leading maker of RF Power Amps and PA Front End Modules for high end Smartphone applications. They have a strong tradition of innovation through R&D.
They are looking for a PA Characterization / Validation Engineer, who will work directly for the PA Design group.
Currently working on behalf of a leading maker of RF ICs, Power Amplifiers and PA Front End Modules for the Smartphone market. The company holds a dominant share of the market in BAW ( Bulk Acoustic Wave) FBAR filters and Duplexers that go into the PA FEM.
They are currently looking for a technical manager, BAW Filter /Duplexer Module Designer.
We are currently working on behalf of our client, a billion in sales leader in the wireless chipset market. They work with power amplifiers, switches, and PA front end modules for commercial wireless applications (cell phone, WLAN, WIMAX, and Infrastructure).
They are currently seeking a Senior Packaging Development Engineer with a BS (or higher) in Mechanical or Chemical Engineering and 5+ years of experience in semiconductor packaging for MCM, LGA, BGA, and QFN form factors .
Working on behalf of our client, a leader in OEM ICs and components for wireless and optical networking markets. They are a leader in Optical Transceivers for datacom and telecom networking applications.
They are looking for an Analog IC Designer, who will design in CMOS an BiCMOS, designing high speed/ gigabit Ethernet circuits like CDRs and TIAs for hi speed networking applications.
Our client is a fast growing market and technology leader in Cell Phone Power Amplifier and PA Front End modules. They have long been the dominant leader in the passive duplexer/filter part of the PA FEM using MEMS/BAW technology. They are the fastest growing player in the PA on chip and PA FEM market. They are a key PA FEM vendor on the most cutting edge and desirable smart phones made.
They are looking for an IC Packaging Engineer with a BS (or higher) in Materials, Mechanical, or Mechanics Engineering and 2-5 years of industry experience in IC Packaging.