Our client is a fast growing market and technology leader in Cell Phone Power Amplifier and PA Front End Modules. We are seeking IC Packaging Engineer responsible for working with substrates, PCBs, and materials.
Location: San Jose
Our client is a fast growing market and technology leader in Cell Phone Power Amplifier and PA Front End Modules. They have been the dominant leader in the duplexer/filter part of the PA FEM using MEMS/BAW technology. They are the fastest growing player in the PA on chip and PA FEM market. They are a key PA FEM vendor on the most cutting edge and desirable smart phones made.
Currently working on behalf of a leading maker of RF ICs, Power Amplifiers and PA Front End Modules for the Smartphone market. Our client holds a dominant share of the market in BAW ( Bulk Acoustic Wave) FBAR filters and Duplexers that go into the PA FEM.
The company is currently looking for a BAW Filter/Duplexer Module Designer.
Working on behalf of a leader in OEM chips and components for wireless and optical networking markets. They are a leader in Optical Transceivers for high speed networking applications.
Company is looking for a Design / Applications Engineer for Fiber Optic Transceiver Modules.
Working on behalf of a leader in RF Power Amps, PA Front End Modules and FBAR Filters for cell phone and WLAN applications. Looking for a Sr RF Test Engineer for RF Prototype (test for Development) Test and transfer to High Volume /Manufacturing test.
Your tasks: Work closely with chipset companies to ensure our test equipment is supported in the chipset manufacturing tools Develop and validate manufacturing solution on various chipsets & ODMs/OEMS products. Provide technical support, demonstration and debug of problems reported by customers and Global Application engineer Work closely with other Application engineers worldwide to support customer Read more…
Our client, based in Sunnyvale, CA, is a successful, fast growing maker of test Equipment for Wireless devices. The company has doubled in revenues over the past two years.
They test portable devices, including smartphones tablets, Laptops and GPS Units, to make sure the devices are manufactured and set up correctly before they leave the factory.
They test the Air Interface Protocols, Connectivity, and other features.
Need a board level RF Designer, who will design up to 10GHz. Integration of discretes and MMIC- based circuits preferred. Wideband (octave+) design experience a plus. Ideal if designer has designed into RF Test equipment.
Our client is an established leader in the Analog and RF/Microwave field. Company has recently become the top maker of 100GB/S Drivers, and is now pushing the envelope with 400 GB/s chips.
Their growth has opened up a need for a High Speed Analog IC Designer.
Our client is a leader in Power Amplifiers and PA Front End Modules for the cell phone and smartphone market. They are currently seeking an advanced Packaging Engineer for RF SiP applications.
We are working on behalf of a leader in RF Power Amps, PA Front End Modules and BAW Filters for cell phone and WLAN applications. Looking for an Applications Engineer , who will design integrate PA ICs, Front End Modules and BAW Filter /Duplexers onto cellphone reference boards, test the boards, validate the parts, and turn out data sheets, aps notes..