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POSTING DATE: 5.15.25 We are working on behalf of a fast-growing maker of complex RF components, including IMAs (Integrated Microwave Assemblies) for Radar, EW, and other Defense applications.. They are based on Long Island, NY. They are looking for a Quality/Manufacturing Engineer, who will drive manufacturing and optimize production efficiency. Will also focus on maintaining […]

POSTING DATE: 5.15.25 Our client is a leading maker of GaAs and GaN hybrids and MMICs for Defense, Cellular and Photonics markets. They are currently seeking a Manager of RF Test and Characterization,  who will lead a team that performs parametric tests GaAs and GaN MMICs, including Power Amplifiers, LNAs, and other circuits on chip. We […]

POSTING DATE: 5.7.25 We are working on behalf of a fast-growing maker of RF components and custom IMAs/ subsystems for Defense markets. Based in the Orlando, FL area, they are looking for an IMA /RF Subsystems Design Engineer. Will design, test, and integrate a broad range of components ( LNA, SSPA, couplers, attenuators, circulators, limiters, […]

POSTING DATE: 5.7.25 We are working on behalf of a fast-growing maker of Crystal Oscillators and other RF components for Defense markets. They are looking for a Crystal Oscillator Design Engineer, based in the Orlando FL area. We need a BSEE or higher with 4-10+ years of experience in design development with either Crystal Oscillators […]

POSTING DATE: 5.6.25 Our client is a fast growing maker of Hybrid microelectronics and Multi-Chip modules for defense and Hi-REL markets. Based in the Northern MA /NH area, they are looking for a Principal Electronics Engineer, who will integrate analog & digital, power and RF ICs into MCMs and onto electronic boards. We need a BS/MSEE, […]

POSTING DATE: 5.2.25 Job Description: As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project […]

POSTING DATE: 5.1.25 We are working on behalf of a fast-growing RF IC Startup, which offers GaAs or GaN on Silicon device technology for PA, LNA and other RF front end circuits. They are targeting 5G, 6G Wireless Infrastructure, SATCOM and Defense markets. Their heterogenous Compound Semi on Silicon device structure allows for better performance […]

POSTING DATE: 5.1.25 Job Description: Company is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These […]