Our client is a leading maker of RF components for Infrastructure, Defense/Aerospace, and Photonics markets. They are currently seeking an Assembler who will be responsible for working with manual wire bonding and die attach equipment. Ideal candidate will have 2 years of experience in microelectronics module assembly and have specific experience operating and setting up manual gold wire bonders and manual eutectic/epoxy die attach systems per microcircuit layout drawing. Previous experience with ISO9001, ISO14011, and MIL STD 883 compliance is highly preferred. No college degree is required.
This role will be an assembly operator working with manual wire bonding and die attach equipment.
Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
Operate and set-up manual Gold wire bonders and manual eutectic/epoxy die attach systems per micro-circuit layout drawing.
Involves working to microcircuit layout drawings; Operator is responsible for proper wire formation, bond appearance and bond strength per Mil Std 883
Operator is responsible for proper die attachment, including coverage and die shear strength per Mil Std 883
Flexibility to be trained in multiple Microelectronics processes that involve other assembly activities
Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.
Experience and Education:
Ability to set-up, operate and adjust or ability to learn to run a variety of microelectronic production equipment.
Minimum of 2 years’ experience in microelectronics module assembly area.
High School diploma required.
Knowledge and Skill Requirements:
Wire-bonding gold wire or ribbon to a variety of die and substrates.
Die attach using solder preforms or epoxy to a variety of components
Operate following all area ESD protocols
Physical Environment and Working Conditions:
Clean-room environment with smocks, masks and gloves.