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POSTING DATE: 5.6.25 Our client is a fast growing maker of Hybrid microelectronics and Multi-Chip modules for defense and Hi-REL markets. Based in the Northern MA /NH area, they are looking for a Principal Electronics Engineer, who will integrate analog & digital, power and RF ICs into MCMs and onto electronic boards. We need a BS/MSEE, […]

POSTING DATE: 5.2.25 Job Description: As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project […]

POSTING DATE: 5.1.25 We are working on behalf of a fast-growing RF IC Startup, which offers GaAs or GaN on Silicon device technology for PA, LNA and other RF front end circuits. They are targeting 5G, 6G Wireless Infrastructure, SATCOM and Defense markets. Their heterogenous Compound Semi on Silicon device structure allows for better performance […]

POSTING DATE: 5.1.25 Job Description: Company is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These […]

POSTING DATE: 5.1.25 Responsibilities • Support high data rate SerDes applications – up to 112Gbps NRZ and 224G PAM4 systems • System level Signal and Power Integrity design trade-offs and debug • Collaborate with package, PCB, and silicon designers to complete measurement-simulation correlation projects • Develop models with electromagnetic field solvers: primarily with Ansys HFSS […]

POSTING DATE: 5.1.25 We are working on behalf of a leading maker of RF ICs and MMICs leveraging GaAs and GaN technologies for Defense and Wireless markets. They are looking for a Principal MMIC Design Engineer, who will report to a group in Milpitas CA, but can be base remotely anywhere in the USA. They […]

POSTING DATE: 4.23.25 We are working on behalf of a medium-sized, fast-growing maker of RF/Microwave modules and IMAs ( Integrated MW Assemblies), based in the Cincinnati, OH area. They make PAs, Up /Down Converters, receivers and complex filters for Defense Comms systems. We are working on behalf of a medium-sized, fast-growing maker of RF/Microwave modules […]

POSTING DATE: 4.23.25 We are working on behalf of a leading maker of RF/Microwave ICs and components that go into Defense and Wireless Infrastructure applications. They have a design facility in Central New Jersey, where they are looking for a Principal Engineer for Analog/Digital control circuits. -This person will design circuitry that controls power and […]